Consumer Electronics Product StudiesMi PowerBank 3i Teardown and Costing

Mi-Power-12-Enclosure Design

Mi PowerBank 3i Teardown and Costing

Disclaimer

This study was conducted entirely in-house by ASI Engineering to demonstrate the capabilities of the xcPEP® platform. The product was independently procured by ASI. No proprietary or confidential information from any other party has been used. Results are not updated after publishing.

Product Section Demo

Software platforms used for this study

This study is powered by ASI’s proprietary should-costing ecosystem - xcPEP and xcPROC - engineered to deliver real-world accurate, traceable should-costing across mechanical, electrical, and electronics components..

xcPEP delivers real-world accurate, transparent & defensible should cost analysis of mechanical, electrical & electronics components from drawings or physical parts.

Explore xcPEP

xcPROC is the centralized database engine powering xcPEP. Built entirely by ASI’s data research team, each database is meticulously curated to be region-specific and time-specific.

Explore xcPROC
Mi-Power-2-Bank-Iso-View
MI-Power-1-Exploded View
Mi-Power-4-Bank-Left-View
Mi-Power-3-PCB-Layout
Mi-Power-6-Bank-Battery-Cell
Mi-Power-7-Bank-Circuit-Protection
Mi-Power-8-Bank-Ports-1
Mi-Power-9--Bank-Fast-Charging-Feature
Consumer electronics should costing
Mi-Power-11-Bank-Charging
Mi-Power-12-Enclosure Design
Mi-Power-13-Bank-Packaging
Mi-Power-14-Assemblies and-Components-Table
Mi-Power-15-Bank-No-of-Component-1
Mi-Power-16-PCB-BOM
Mi-Power-17-Assembly-weight-distribution
Mi-Power-18-Weight-Pareto-Graph
Mi-Power-19-Bank-Manufacturing-Category
Mi-Power-20-Bank-Should-costing-table
Mi-Power-21-Bank-Should-Cost-Driver-Graph
Mi-Power-22-Bank-PCB-Costing
Mi-Power-23-Bank-Should-Cost-Breakdown
Mi-Power-24-Bank-Should-Cost-Pareto-analysis-graph