Consumer Electronics Product StudiesBluetooth Earphone Teardown, BOM and Costing

Bluetooth-9-Printed Circuit Board and Electronic Child Components

Bluetooth Earphone Teardown, BOM and Costing

Disclaimer

This study was conducted entirely in-house by ASI Engineering to demonstrate the capabilities of the xcPEP® platform. The product was independently procured by ASI. No proprietary or confidential information from any other party has been used. Results are not updated after publishing.

Bluetooth-1-Exploded view driver
Bluetooth-2-Exploded View Earphone
Bluetooth-3-Fast-Charge
Bluetooth-4-Neckband Connectivity
Bluetooth-5-Charging Technology-3
Bluetooth-7-Magnetic Functions
Bluetooth-8-Earphone Accessories
Bluetooth-9-Printed Circuit Board and Electronic Child Components
Bluetooth-10-Packaging Earphone-4
Bluetooth-11-Headphone Accessories-5
Bluetooth-12-Headphone package Items-6
Bluetooth-13-Neckband Earphone no of components Table
Bluetooth-14-Neckband Earphone no of components
Bluetooth-15-Neckband Earphone xcPEP BOM page
Bluetooth-16-Neckband Earphone Assembly Weight Distribution
Bluetooth-17-Neckband Earphone Weight Pareto
Bluetooth-18-Neckband Earphone Manufacturing category
Bluetooth-19-Neckband Earphone Should Cost Driver table
Bluetooth-20-Neckband Earphone Should Cost Driver
Bluetooth-21-Should Costing Earphone PCB
Bluetooth-22-Neckband Earphone Should Cost Breakdown
Bluetooth-23-Neckband Earphone Should Cost Pareto